Description
Product name: DAWN PRO High-performance Portable DAC/AMP Weight: 13g Size: 42mm*22.45mm*12.39mm Earphone Jack: 3.5mm single-ended 4.4mm balanced jack Frequency Range: 5Hz – 82kHz (+1dB) Noise Floor: 4.4mm:1.3V (AES17 20kHz) 3.5mm:1.5V (AES17 20kHz) SNR: 4.4mm:131dB(A-wt) 3.5mm:123dB(A-wt) Line Out: 4.4mm:4Vrms 3.5mm:2Vrms Dynamic Range: 4.4mm:132dB (A-wt) THD+N Ratio: 0.00014% (AES17 20kHz, non-loaded) Package contents: [DAWN PRO] Micro DAC +AMP Type-C to Type-C adapter cable*1 Type-A to Type-C adapter*1
From the brand
- Workable well with computers, Smartphones, and Laptops Offers Both Lossless and Master Audio: DAWN PRO is compatible with most available computers, smartphones, and laptops, and supports decoding PCM from 16Bit/44. 1kHz to 32Bit/384kHz, even for 1Bit with DSD512.
- Dual Cirrus Logic flagship decoding chips, Three independent power chips: DAWN PRO adopts dual flagship decoding amp chips CS43131 from Cirrus Logic, and uses HiFi-class USB digital interface chip, dual independent crystal oscillators, and three independent power supply chips for supplying each IC separately, forming a set of high-efficiency and high-performance HiFi audio circuit architecture, which meets enough thrust, ultra-low distortion, ultra-low noise and rich details in audio experience
- 100-level Smooth DAC Volume Control: Almost lossless 100-level volume control, which separates the device volume control from smartphone, not only presents better performance but also brings a smooth control experience.
- 3.5mm Single ended+4.4mm Balanced Outputs: The 3.5mm single ended port ensures a wider compatility The 4. 4mm balanced port provides twice the performance of single ended output.
- Aluminum Alloy Housing, Diversion and Heat Dissipation Design: The housing of DAWN PRO combines the aviation aluminum alloy, CNC and mold forming, and the surface is processed by the anodized, which has excellent texture and durability.t In the design of the heat dissipation structure, DAWN PRO has utilized the design idea of desktop HiFi devices, and the heat dissipation vents are set above the chips which generate more heat, improving the heat dissipation efficiency.
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